Semiconductor package with stacked substrates and multiple semiconductor dice

ABSTRACT

A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 09/834,706,filed Apr. 13, 2001, now U.S. Pat. No. 6,404,044 B2, issued Jun. 11,2002, which is a continuation of application Ser. No. 09/466,454, filedDec. 17, 1999, now U.S. Pat. No. 6,222,265, issued Apr. 24, 2001, whichis a continuation of application Ser. No. 09/233,997, filed Jan. 19,1999, now U.S. Pat. No. 6,051,878, issued Apr. 18, 2000, which is adivisional of application Ser. No. 08/813,467, filed Mar. 10, 1997, nowU.S. Pat. No. 5,994,166, issued Nov. 30, 1999.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an apparatus and a method forincreasing semiconductor device density. In particular, the presentinvention relates to a stacked multi-substrate device using acombination of flip chips and chip-on-board assembly techniques toachieve densely packaged semiconductor devices.

2. State of the Art

Chip-On-Board techniques are used to attach semiconductor dice to aprinted circuit board, including flip chip attachment, wirebonding, andtape automated bonding (“TAB”). Flip chip attachment consists ofattaching a flip chip to a printed circuit board or other substrate. Aflip chip is a semiconductor chip that has a pattern or array ofelectrical terminations or bond pads spaced around an active surface ofthe flip chip for face down mounting of the flip chip to a substrate.Generally, the flip chip has an active surface having one of thefollowing electrical connectors: Ball Grid Array (“BGA”)—wherein anarray of minute solder balls is disposed on the surface of a flip chipthat attaches to the substrate (“the attachment surface”); SlightlyLarger than Integrated Circuit Carrier (“SLICC”)—which is similar to aBGA, but having a smaller solder ball pitch and diameter than a BGA; ora Pin Grid Array (“PGA”)—wherein an array of small pins extendssubstantially perpendicularly from the attachment surface of a flipchip. The pins conform to a specific arrangement on a printed circuitboard or other substrate for attachment thereto. With the BGA or SLICC,the solder or other conductive ball arrangement on the flip chip must bea mirror-image of the connecting bond pads on the printed circuit boardsuch that precise connection is made. The flip chip is bonded to theprinted circuit board by refluxing the solder balls. The solder ballsmay also be replaced with a conductive polymer. With the PGA, the pinarrangement of the flip chip must be a mirror-image of the pin recesseson the printed circuit board. After insertion, the flip chip isgenerally bonded by soldering the pins into place. An under-fillencapsulant is generally disposed between the flip chip and the printedcircuit board for environmental protection and to enhance the attachmentof the flip chip to the printed circuit board. A variation of thepin-in-recess PGA is a J-lead PGA, wherein the loops of the J's aresoldered to pads on the surface of the circuit board.

Wirebonding and TAB attachment generally begin with attaching asemiconductor chip to the surface of a printed circuit board with anappropriate adhesive, such as an epoxy. In wirebonding, bond wires areattached, one at a time, to each bond pad on the semiconductor chip andextend to a corresponding lead or trace end on the printed circuitboard. The bond wires are generally attached through one of threeindustry-standard wirebonding techniques: ultrasonic bonding—using acombination of pressure and ultrasonic vibration bursts to form ametallurgical cold weld; thermocompression bonding—using a combinationof pressure and elevated temperature to form a weld; and thermosonicbonding—using a combination of pressure, elevated temperature, andultrasonic vibration bursts. The semiconductor chip may be orientedeither face up or face down (with its active surface and bond padseither up or down with respect to the circuit board) for wire bonding,although face up orientation is more common. With TAB, ends of metalleads carried on an insulating tape, such as a polyamide, arerespectively attached to the bond pads on the semiconductor chip and tothe lead or trace ends on the printed circuit board. An encapsulant isgenerally used to cover the bond wires and metal tape leads to preventcontamination.

Higher performance, lower cost, increased miniaturization of components,and greater packaging density of integrated circuits are ongoing goalsof the computer industry. As new generations of integrated circuitproducts are released, the number of devices used to fabricate themtends to decrease due to advances in technology even though thefunctionality of these products increases. For example, on the average,there is approximately a 10 percent decrease in components for everyproduct generation over the previous generation with equivalentfunctionality.

In integrated circuit packaging, in addition to component reduction,surface mount technology has demonstrated an increase in semiconductorchip density on a single substrate or board despite the reduction of thenumber of components. This results in more compact designs and formfactors and a significant increase in integrated circuit density.However, greater integrated circuit density is primarily limited by thespace or “real estate” available for mounting dice on a substrate, suchas a printed circuit board.

One method of further increasing integrated circuit density is to stacksemiconductor dice vertically. U.S. Pat. No. 5,012,323, issued Apr. 30,1991 to Farnworth, teaches combining a pair of dice mounted on opposingsides of a lead frame. An upper, smaller die is back-bonded to the uppersurface of the leads of the lead frame via a first adhesively coated,insulated film layer. A lower, larger die is face-bonded to the lowerlead frame die-bonding region via a second, adhesively coated,insulative film layer. The wirebonding pads on both upper die and lowerdie are interconnected with the ends of their associated lead extensionswith gold or aluminum bond wires. The lower die must be slightly largerthan the upper die such that the die pads are accessible from abovethrough a bonding window in the lead frame such that gold wireconnections can be made to the lead extensions. This arrangement has amajor disadvantage from a production standpoint as the same size diecannot be used.

U.S. Pat. No. 5,291,061, issued Mar. 1, 1994 to Ball (“Ball”), teaches amultiple stacked dice device containing up to four stacked dicesupported on a die-attach paddle of a lead frame, the assembly notexceeding the height of current single die packages, and wherein thebond pads of each die are wirebonded to lead fingers. The low profile ofthe device is achieved by close-tolerance stacking which is madepossible by a low-loop-profile wirebonding operation and thin adhesivelayers between the stacked dice. However, Ball requires long bond wiresto electrically connect the stacked dice to the lead frame. These longbond wires increase resistance and may result in bond wire sweep duringencapsulation. Also, Ball requires the use of spacers between the dice.

U.S. Pat. No. 5,323,060, issued Jun. 21, 1994 to Fogal et al. (“Fogal”),teaches a multi-chip module that contains stacked die devices, theterminals or bond pads of which are wirebonded to a substrate or toadjacent die devices. However, as discussed with Ball, Fogal requireslong bond wires to electrically connect the stacked die bond pads to thesubstrate. Fogal also requires the use of spacers between the dice.

U.S. Pat. Nos. 5,422,435 and 5,495,398 to Takiar et al. (“Takiar”),teach stacked dice having bond wires extending to each other and to theleads of a carrier member such as a lead frame. However, Takiar also hasthe problem of long bond wires, as well as, requiring specific sized orcustom designed dice to achieve a properly stacked combination.

U.S. Pat. No. 5,434,745, issued Jul. 18, 1995 to Shokrgozar et al.(“Shokrgozar”), discloses a stackable packaging module comprising astandard die attached to a substrate with a spacer frame placed on thesubstrate to surround the die. The substrate/die/spacer combinations arestacked one atop another to form a stacked assembly. The outer edge ofthe spacer frame has grooves in which a conductive epoxy is disposed.The conductive epoxy forms electric communication between the stackedlayers and/or to the final substrate to which the stacked assembly isattached. However, Shokrgozar requires specialized spacer frames and asubstantial number of assembly steps, both of which increase the cost ofthe final assembly.

U.S. Pat. No. 5,128,831, issued Jul. 7, 1992 to Fox, III et al. (“Fox”),also teaches a standard die attached to a substrate with a spacer frameplaced on the substrate to surround the die. The stacked layers and/orthe final substrate are in electric communication with conductive viasextending through the spacer frames. However, Fox also requiresspecialized spacer frames, numerous assembly steps, and is limited inits flexibility to utilize a variety of dice.

U.S. Pat. No. 5,513,076, issued Apr. 30, 1996 to Wether (“Wether”),teaches the use of interconnecting assemblies to connect integratedcircuits in an integrated manner.

As has been illustrated, none of the cited prior art above uses orteaches flip chip manufacturing methods for attaching dice together in astacked manner to form a stacked die assembly.

Therefore, it would be advantageous to develop a stacking technique andassembly for increasing integrated circuit density using a variety ofnon-customized die configurations in combination withcommercially-available, widely-practiced semiconductor devicefabrication techniques.

BRIEF SUMMARY OF THE INVENTION

The present invention relates to a stacked multi-substrate device usingcombined flip chips and chip-on-board assembly techniques to achievedensely packaged semiconductor devices, and a method for making same. Inthis invention, multiple substrates are stacked atop one another. Thesubstrates can include a plurality of semiconductor dice disposed oneither surface of the substrates. The substrates can be structures ofplanar non-conductive material, such as fiberglass material used forPCBs, or may even be semiconductor dice. For the sake of clarity, theterm “substrate”, as used hereinafter, will be defined to include planarnonconductive materials and semiconductor dice. The substrates arepreferably stacked atop one another by electric connections which areball or column-like structures. Alternately, solder bumps or balls maybe formed on the substrate. The electric connections achieve electriccommunication between the stacked substrates. The electric connectionscan be formed from industry standard solder forming techniques or fromother known materials and techniques, such as conductive adhesives,Z-axis conductive material, flex-contacts, spring contacts, wire bonds,TAB tape, and the like. The electric connections must be of sufficientheight to give clearance for the components mounted on the substratesand should be sufficiently strong enough to give support between thestacked substrates.

A preferred embodiment comprises a base substrate, having first andopposing surfaces, and means for electrical connection with externalcomponents or substrates, wherein the electrical connection meansextends at least from the first surface of the base substrate. The basesubstrate opposing surface, the other side of the substrate, alsoincludes a plurality of bond pads disposed thereon. Additionally, atleast one semiconductor component may be attached to the opposingsurface of the base substrate. The semiconductor components arepreferably flip chips that are in electrical communication withelectrical traces on or within the base substrate with any convenientknown chip-on-board (COB) or direct-chip-attachment (DCA) technique(i.e., flip chip attachment, wirebonding, and TAB). Other techniques,such as the use of two-axis materials or conductive epoxies, can also beused for connections between either substrates or substrates andsemiconductor chips. The electrical traces form a network ofpredetermined electrical connections between the base substrateelectrical connection means, the base substrate bond pads, and/or thebase substrate semiconductor components.

The preferred embodiment further comprises a stacked substrate. Thestacked substrate has a first surface and an opposing surface. Aplurality of bond pads may be disposed on the stacked substrate firstsurface and/or the stacked substrate opposing surface. At least onesemiconductor component is attached to each of the stacked substratefirst surface and the stacked substrate opposing surface. Thesemiconductor components are preferably flip chips which are inelectrical communication with electrical traces on or within the firststacked substrate. The electrical traces form a network of predeterminedelectrical connections between the stacked substrate first surface bondpads, the stacked substrate opposing surface bond pads, and/or thestacked substrate semiconductor components.

The stacked substrate is attached to the base substrate through aplurality of electric connections. The electric connections can becolumn-like structures or spherical structures (balls) that support andform electrical communication between the base substrate bond pads andeither the stacked substrate first surface bond pads or the stackedsubstrate opposing surface bond pads (depending upon which stackedsubstrate surface faces the base substrate first surface). The electricconnections are preferably distributed evenly around a periphery of thebase and stacked substrates. However, the electric connections may be ofany distribution so long as adequate mechanical support exists betweenthe base substrate and the stacked substrate.

In the manner discussed for the stacked substrate, additional stackedsubstrates may be attached to and stacked above the stacked substrate.Thus, with this technique, a multiple stacked substrate component may beformed. It is, of course, understood that the electrical connectionmeans extending from the base substrate first surface for communicationwith an outside substrate may not be necessary if the multiple stackedsubstrate is in and of itself a complete component.

An alternative embodiment comprises substrates of varying size in asingle assembly. The variable size substrate assembly is constructed inthe manner discussed above. However, the variable size substrateassembly includes smaller sized substrates than the previously discussedbase and stacked substrate. The smaller substrate is essentiallyidentical to the previously discussed stacked substrate. The smallersubstrate comprises a first surface and an opposing surface with aplurality of bond pads which may be disposed on the smaller substratefirst surface and/or the smaller substrate opposing surface. At leastone semiconductor component may be attached to the smaller substratefirst surface and/or the smaller substrate opposing surface. Thesemiconductor components are in electrical communication with electricaltraces on or within the first stacked substrate. The electrical tracesform a network of predetermined electrical connections between thesmaller substrate first surface bond pads, the smaller substrateopposing surface bond pads, and/or the smaller substrate semiconductorcomponents.

The smaller substrate may be disposed between the base substrate and thestacked substrate. The smaller substrate is attached to either the basesubstrate or the stacked substrate through a plurality of electricconnections. The electric connections form electrical communicationbetween the base substrate bond pads and the smaller substrate bond padsor between the stacked substrate bond pads and the smaller substratebond pads (depending upon whether the smaller substrate is attached tothe base substrate or the stacked substrate). The smaller substrate mayalso be attached to the opposite surface of the stacked substrate andmultiple smaller substrates may be attached in various positions on anysubstrate in the variable size substrate assembly.

Thus, the present invention offers the advantages of and achievessuperior and improved electrical properties and speed of submodules andthe entire module assembly, achieves higher density input/outputconfigurations and locations (array), achieves higher density of devicesor complexities of integrated circuits because of optimum input/outputlocations, results in improved thermal performance, allows easier repairand reusability, and allows easier modification of the package.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming that which is regarded as the present invention,the advantages of this invention can be more readily ascertained fromthe following description of the invention when read in conjunction withthe accompanying drawings in which:

FIG. 1 is a side cross-sectional view of a first stacked assembly of thepresent invention;

FIG. 2 is a perspective view of a substrate of the present inventionwhich has uniform periphery bond pads;

FIG. 3 is a perspective view of a substrate of the present inventionwhich has non-uniform bond pads;

FIG. 4 is a side cross-sectional view of a variable stack size assemblyof the present invention;

FIG. 5 is a perspective view of a variable stack size assembly of thepresent invention; and

FIG. 6 is a cross-sectional view of a variable stack size assembly ofthe present invention using flip chip bonding techniques.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 illustrates a first stacked assembly 100 of the presentinvention. The stacked assembly 100 comprises a base substrate 102having a first surface 104 with a plurality of bond pads 106 disposedthereon and a second surface 108 with a plurality of bond pads 110disposed thereon. Each of the base substrate first surface bond pads 106is in electrical communication with its respective base substrate secondsurface bond pads 110 via a plurality of lead traces 112 extendingthrough the base substrate 102. A plurality of electric connections 114extends from the base substrate first surface bond pads 106. The basesubstrate electric connections 114 make contact with the othercomponents or substrates.

The stacked assembly 100 further includes a first stacked substrate 116having a first surface 118 with a plurality of bond pads 120 and asecond surface 122 with a plurality of bond pads 124 disposed thereon.The first stacked substrate 116 is in electrical communication with thebase substrate second surface 108 via a plurality of first electricconnections 126. The first electric connections 126 extend between eachfirst stacked substrate first surface bond pad 120 and its respectivebase substrate second surface bond pad 110. The bond pads of both thefirst stacked substrate 116 and base substrate 102 are preferablylocated such that each respective bond pad pair aligns perpendicularly.

A plurality of first semiconductor dice 128 each having a face side 130and a back side 132 is attached to each of the first stacked substratefirst surface 118 and the first stacked substrate second surface 122with a first layer of adhesive 134 applied to the first semiconductordie back sides 132. The first semiconductor dice 128 are in electricalcontact with a plurality of first stacked substrate electrical traces136 via TAB bonds 138. The first stacked substrate electrical traces 136extend in or on the first stacked substrate 116 and may contact thefirst stacked substrate first surface bond pad 120, the first stackedsubstrate second surface bond pad 124, and/or another firstsemiconductor die 128.

The stacked assembly 100 still further includes a second stackedsubstrate 140 having a first surface 142 with a plurality of bond pads144 thereon and a second surface 146. The second stacked substrate 140is in electrical communication with the first stacked substrate secondsurface 122 via a plurality of second electric connections 148. Thesecond electric connections 148 extend between each second stackedsubstrate first surface bond pad 144 and its respective first stackedsubstrate second surface bond pad 124. The bond pads of both the secondstacked substrate 140 and first stacked substrate 116 are preferablylocated such that each respective bond pad pair aligns perpendicularly.

A plurality of second semiconductor dice 150 each having a face side 152and a back side 154 is attached to the second stacked substrate firstsurface 142 with a second layer of adhesive 156 applied to the secondsemiconductor die back sides 154. The second semiconductor dice 150 arein electrical contact with a plurality of second stacked substrateelectrical traces 158 via wirebonds 160. A plurality of thirdsemiconductor dice 162 each having a face side 164 is attached to thesecond stacked substrate second surface 146 with a plurality of flipchip contacts 166, such as BGA, PGA or the like. The flip chip contacts166 are in electrical contact with the second stacked substrateelectrical traces 158. The second stacked substrate electrical traces158 extend in or on the second stacked substrate 140 and may contact thesecond stacked substrate first surface bond pads 144, the secondsemiconductor dice 150 and/or another third semiconductor die 162.

A flip chip dielectric material 168 may be disposed between the thirdsemiconductor dice face side 164 and the second stacked substrate secondsurface 146. Additionally, a dielectric material 170 may be disposedbetween the base substrate 102 and the first stacked substrate 116,and/or the first stacked substrate 116 and the second stack substrate140. Furthermore, an encapsulation material 172 may cover the stack diceportion of the stacked assembly 100.

It is, of course, understood that any available substrate surface, suchas the base substrate second surface 108, may have semiconductor diceattached thereto.

FIG. 2 illustrates a substrate assembly 200 having a uniform bond padarrangement, such as shown as the first surface 142 of the secondstacked substrate 140 in FIG. 1. The substrate assembly 200 comprises asubstrate 202 with a plurality of bond pads 204 distributed about aperiphery 206 of a surface 208 of the substrate 202. A plurality ofsemiconductor dice 210 is disposed on the substrate surface 208 withinthe bond pads 204. The semiconductor dice 210 have a face side 212 and aback side 214. The semiconductor dice 210 are attached by an adhesivelayer 216 applied to the semiconductor dice back side 214 and makeelectrical contact with the substrate surface 208 by a plurality of bondwires 218. Such an arrangement of bond pads 204 yields a strong,well-supported structure.

The distribution of the bond pads and the semiconductor dice need not beuniform, so long as the distribution allows adequate support betweensubstrates. FIG. 3 illustrates a substrate assembly 300 having anon-uniform bond pad arrangement. The substrate assembly 300 comprises asubstrate 302 with a plurality of bond pads 304 distributed in anon-uniform pattern across a surface 306 of the substrate 302. Aplurality of semiconductor dice 308 is disposed on the substrate surface306. The semiconductor dice 308 have a face side 310 and a back side312. The semiconductor dice 308 are attached by an adhesive layer 314applied to the semiconductor dice back side 312 and make electricalcontact with the substrate surface 306 by a plurality of bond wires 316.

FIG. 4 illustrates a variable stack size assembly 400 of the presentinvention. The variable stack size assembly 400 comprises a firststacked substrate 402 having a surface 404 with a plurality of firstbond pads 406 and second bond pads 408 disposed thereon. A plurality offirst semiconductor dice 410 each having a face side 412 and a back side414 is attached to the first stacked substrate surface 404 with a firstlayer of dielectric adhesive 416 applied to the first semiconductor dieback sides 414. The first semiconductor dice 410 are in electriccommunication with a plurality of first stacked substrate electricaltraces (not shown) via wirebonds 418.

The variable stack size assembly 400 further includes a first smallstacked substrate 420 having a first surface 422 with a plurality ofbond pads 424 disposed thereon and a second surface 426. The first smallstacked substrate 420 is in electrical communication with the firststacked substrate surface 404 via a plurality of first small stackedsubstrate electric connections 428. The first small stacked substrateelectric connections 428 extend between each first stacked substratesurface first bond pad 406 and its respective first small stackedsubstrate first surface bond pad 424. The bond pads of both the firststacked substrate 402 and first small stacked substrate 420 arepreferably located such that each respective bond pad pair alignsperpendicularly. At least one second semiconductor die 430 having a faceside 434 and a back side 432 is attached to the first small stackedsubstrate second surface 426 with a second layer of dielectric adhesive436. The second semiconductor die 430 is in electric communication witha plurality of first small stacked substrate electrical traces (notshown) via wirebonds 438.

The variable stack size assembly 400 still further includes a secondstacked substrate 440 having a first surface 442 with a plurality ofbond pads 444 thereon and a second surface 446 with a plurality of bondpads 448. The second stacked substrate 440 is in electricalcommunication with the first stacked substrate surface 404 via aplurality of first electric connections 450. The first electricconnections 450 extend between each second stacked substrate firstsurface bond pad 444 and its respective first stacked substrate secondsurface bond pad 408. The bond pads of both the second stacked substrate440 and first stacked substrate 402 are preferably located such thateach respective bond pad pair aligns perpendicularly.

A plurality of third semiconductor dice 452 each having a face side 454and a back side 456 is attached to the second stacked substrate secondsurface 446 with a third layer of dielectric adhesive 458 applied to thethird semiconductor die back sides 456. The third semiconductor dice 452are in electric communication with a plurality of second stackedsubstrate electrical traces (not shown) via wirebonds 460.

The variable stack size assembly 400 still further includes a thirdstacked substrate 462 having a first surface 464 with a plurality ofbond pads 466 thereon and a second surface 468 with a plurality of bondpads 470 thereon. The third stacked substrate 462 is in electricalcommunication with the second stacked substrate second surface 446 via aplurality of second electric connections 472. The second electricconnections 472 extend between each third stacked substrate firstsurface bond pad 466 and its respective second stacked substrate secondsurface bond pad 448. The bond pads of both the third stacked substrate462 and second stacked substrate 440 are preferably located such thateach respective bond pad pair aligns perpendicularly.

A plurality of fourth semiconductor dice 474 each having a face side 476and a back side 478 is attached to the third stacked substrate firstsurface 464 with a fourth layer of dielectric adhesive 480 applied tothe fourth semiconductor die back sides 478. The fourth semiconductordice 474 are in electrical contact with a plurality of third stackedsubstrate electrical traces (not shown) via wirebonds 482. A pluralityof fifth semiconductor dice 484 each having a face side 486 and a backside 488 is attached to the third stacked substrate second surface 468with a fifth layer of dielectric adhesive 490 applied to the fifthsemiconductor die back sides 488. The fifth semiconductor dice 484 arein electric communication with a plurality of third stacked substrateelectrical traces (not shown) via wirebonds 492.

The variable stack size assembly 400 further includes a second smallstacked substrate 494 having a first surface 496 with a plurality ofbond pads 498 disposed thereon and a second surface 500. The secondsmall stacked substrate 494 is in electrical communication with thethird substrate second surface 468 via a plurality of second smallsubstrate electric connections 502. The second small substrate electricconnections 502 extend between each second small stacked substrate firstsurface bond pad 498 and its respective third stacked substrate secondsurface bond pad 470. The bond pads of both the second small stackedsubstrate 494 and third stacked substrate 462 are preferably locatedsuch that each respective bond pad pair aligns perpendicularly. At leastone sixth semiconductor die 504 having a face side 506 and a back side508 is attached to the second small stacked substrate first surface 496with a sixth layer of dielectric adhesive 510. The sixth semiconductordie 504 is in electric communication with a plurality of second smallstacked substrate electrical traces (not shown) via wirebonds 512. Atleast one seventh semiconductor die 514 having a face side 516 and aback side 518 is attached to the second small stacked substrate secondsurface 500 with a seventh layer of dielectric adhesive 520. The seventhsemiconductor die 514 is in electric communication with a plurality ofsecond small stacked substrate electrical traces (not shown) viawirebonds 522. Although the electrical traces of the substrates have notbeen illustrated, it is understood that electrical traces makeelectrical connections in the same manner as described for FIG. 1.

FIG. 5 illustrates a substrate assembly 600 having a smaller substrate602 on a larger substrate 604, such as shown as third stacked substrate462 and second small stacked substrate 494 in FIG. 4. The substrateassembly 600 comprises the larger substrate 604 having a plurality offirst semiconductor dice 606 and the smaller substrate 602 disposed on asurface 608 of the larger substrate 604. The first semiconductor dice606 have a face side 612 and a back side 614. The first semiconductordice 606 are attached by a first layer of adhesive 616 applied to thesemiconductor dice back side 614 and make electrical contact with thesubstrate surface 608 by a plurality of first bond wires 618. Thesmaller substrate 602 has a first surface 620 and a second surface 622.The smaller substrate 602 has a plurality of electrical contacts 624extending between a plurality of bond pads 626 on the smaller substratefirst surface 620 and a plurality of bond pads 628 on the largersubstrate surface 608. A plurality of second semiconductor dice 630(only one shown) is disposed on the smaller substrate second surface622. The second semiconductor dice 630 have a face side 634 and a backside 636. The second semiconductor dice 630 are attached by a secondlayer of adhesive 638 applied to the second semiconductor dice back side636 and make electrical contact with the smaller substrate secondsurface 622 by a plurality of bond wires 640. Although the electricaltraces of the smaller substrate have not been illustrated, it isunderstood that electrical traces make electrical connections in thesame manner as described for FIG. 1.

FIG. 6 illustrates a substrate assembly 700 having a plurality ofsemiconductor devices mounted on substrates using known flip chipattachment techniques. The substrate assembly 700 comprises a firstsubstrate 704 having a plurality of first semiconductor dice 702disposed thereon and a second substrate 708 having a plurality of secondsemiconductor dice 706 disposed thereon. The first semiconductor dice702 each have a surface or face side 710 having a plurality of bond pads(not shown) thereon and a back side 712. The first semiconductor dice702 make electrical contact with the traces (not shown) on the firstsubstrate surface 714 by a plurality of first conductive material balls716 extending between the bond pads (not shown) on the face surface 710of the dice 702 and the traces (not shown) on the first substratesurface 714. The balls 716 may be made of any suitable conductivematerial to connect the semiconductor dice 702 to the conductive traceson first substrate 704, such as solder, conductive epoxy, etc. The balls716 are shown as generally spherical in shape, although they may be anysuitable geometric shape and size for bonding purposes. Further, z-axisconnectors may be substituted for the balls 716 if so desired. Thesecond substrate 708 has a surface 718 having a plurality of conductivetraces (not shown) thereon. The second plurality of semiconductor dice706 each have a face side 720 having a plurality of bond pads (notshown) thereon and a back side 722. The second plurality ofsemiconductor dice 706 make electrical contact with the second substratesurface 718 by a plurality of second conductive material balls 724extending between the bond pads of the dice 706 and the conductivetraces on the second substrate surface 718. The balls 724 may be made ofany suitable conductive material to connect the semiconductor dice 706to the conductive traces on second substrate 708, such as solder,conductive epoxy, etc. The balls 724 are shown as generally spherical inshape, although they may be any suitable geometric shape and size forbonding purposes. Further, z-axis connectors may be substituted forballs 724 if so desired. The desired conductive traces on the surface714 of the first substrate 704 are connected to the desired conductivetraces on the surface 718 of the second substrate 708 by largerconductive balls 726. The larger conductive balls 726 may be of anysuitable conductive material, such as solder, conductive epoxy, etc. Thelarger conductive balls are also used for connecting the surface 728 ofthe first substrate 704 to any other desired substrate. Further, z-axisconnectors may be substituted for balls 726 if so desired. It should beunderstood that the conductive traces which have only been referred toon the surfaces 714 and 718 of the substrates may be formed on eitherside of the first substrate 704 or the second substrate 708 and, assuch, have not been illustrated. Also, any connectors extending throughthe first substrate 704 and second substrate 708 for connection purposeshave not been shown. Similarly, the bond pads on the first semiconductordice 702 and second semiconductor dice 706 have not been illustrated.The first semiconductor dice 702 are attached to the first substrate 704and the second semiconductor dice 706 are attached to the secondsubstrate 708 by well known flip chip bonding techniques, depending uponthe type of conductive balls 716 and 724 used for connection purposes.

FIGS. 4, 5 and 6, as shown, illustrate complete electrical components.As an example, the smaller stacked substrates (i.e., first small stackedsubstrate 420 and second small stacked substrate 494 of FIG. 4, andsmaller substrate 602 of FIG. 5) could be memory modules containing aplurality of memory chips. These smaller stacked substrates orsemiconductor devices are connected to the larger substrates (i.e.,first stacked substrate 402 and third stacked substrate 462 of FIG. 4,larger substrate 604 of FIG. 5 or first semiconductor dice 702 stackedon first substrate 704 and second semiconductor devices 706 stacked onsecond substrate 708 of FIG. 6), which could be the motherboard portionswith control logic circuits and a central processing unit(s). Thus, thecombination of these example components could constitute a completecomponent. However, it is, of course, understood that the embodimentsshown in FIGS. 4, 5 and 6 could include electric connections (such aselectric connections 114 of FIG. 1) to connect to other components orother substrates.

Having thus described in detail preferred embodiments of the presentinvention, it is to be understood that the invention defined by theappended claims is not to be limited by particular details set forth inthe above description as many apparent variations thereof are possiblewithout departing from the spirit or scope thereof.

What is claimed is:
 1. A stacked assembly, comprising: a base substratehaving a first surface including a plurality of bond pads; at least onefirst semiconductor die having an active surface having at least onebond pad thereon and having a second surface; a first stackednonconductive substrate having a first surface and a second surface,said at least one first semiconductor die electrically connected to saidfirst surface of said first stacked nonconductive substrate and havingsaid second surface thereof disposed on at least one portion of saidfirst surface of said first stacked nonconductive substrate; at leastone second semiconductor die having a first surface having a pluralityof bond pads located thereon, said first surface of said at least onesecond semiconductor die attached to at least one portion of said secondsurface of said first stacked nonconductive substrate; at least onefirst connector connecting said at least one bond pad of said at leastone first semiconductor die to at least one bond pad of said pluralityof bond pads of said base substrate; at least one second connectorconnecting at least one bond pad of said plurality of bond pads of saidat least one second semiconductor die to at least one other bond pad ofsaid plurality of bond pads of said base substrate; a second stackednonconductive substrate having a first surface and a second surface; atleast one third semiconductor die having a first surface having aplurality of bond pads located thereon, said first surface of said atleast one third semiconductor die attached to at least one portion ofsaid first surface of said second stacked nonconductive substrate; andat least one third connector connecting at least one bond pad of saidplurality of bond pads of said at least one third semiconductor die tosaid first surface of said first stacked nonconductive substrate.
 2. Theassembly of claim 1, wherein said at least one first semiconductor dieis located on a portion of said first surface of said first stackednonconductive substrate being electrically connected to said firststacked nonconductive substrate thereat.
 3. The assembly of claim 1,wherein said second surface of said first stacked nonconductivesubstrate includes a plurality of bond pads; and wherein said at leastone second semiconductor die is located on and electrically connected tosaid at least one portion of said second surface of said first stackednonconductive substrate.
 4. The assembly of claim 1, wherein said atleast one first connector includes one of solder, conductive adhesives,Z-axis conductive material, flex-contacts, spring contacts, wire bonds,and TAB tape.
 5. The assembly of claim 1, wherein said base substratefurther comprises a second surface having a plurality of bond padslocated thereon.
 6. The assembly of claim 5, further comprisingconnections attached to said plurality of bond pads of said secondsurface of said base substrate for connection with external electricalcircuitry.
 7. The assembly of claim 6, further comprising a plurality oftrace leads located on said base substrate connecting said plurality ofbond pads of said first surface of said base substrate and saidplurality of bond pads of said second surface of said base substrate. 8.The assembly of claim 1, further comprising: a base semiconductor diehaving a plurality of bond pads and disposed on said base substratefirst surface; and at least one fourth connector connecting at least oneof said plurality of bond pads of said first surface of said basesubstrate and said at least one bond pad of said at least one firstsemiconductor die.
 9. An assembly comprising: a base substrate having afirst surface including a plurality of bonds pads thereon, a secondsurface including a plurality of bond pads thereon, and a plurality oftraces, at least one trace of said plurality of traces connecting atleast one bond pad of said plurality of bond pads on said first surfaceof said base substrate to at least one bond pad of said plurality ofbond pads on said second surface of said base substrate; a first stackednonconductive substrate having a first surface including a plurality ofbond pads thereon, a second surface including a plurality of bond padsthereon, a first plurality of traces, at least one trace of said firstplurality of traces connecting at least one bond pad of said pluralityof bond pads on said first surface of said first stacked nonconductivesubstrate to at least one bond pad of said plurality of bond pads onsaid second surface of said first stacked nonconductive substrate, and asecond plurality of traces, at least one trace of said second pluralityof traces connected to another bond pad of said plurality of bond padson said first surface of said first stacked nonconductive substrate; afirst semiconductor die disposed on said first surface of said firststacked nonconductive substrate, said first semiconductor die connectedto said at least one trace of said second plurality of traces connectedto said another bond pad of said plurality of bond pads on said firstsurface of said first stacked nonconductive substrate; a second stackednonconductive substrate having a first surface including a plurality ofbond pads thereon, a second surface including a plurality of bond padsthereon, a first plurality of traces, at least one trace of said firstplurality of traces of said second stacked nonconductive substrateconnecting at least one bond pad of said plurality of bond pads on saidfirst surface of said second stacked nonconductive substrate to at leastone bond pad of said plurality of bond pads on said second surface ofsaid second stacked nonconductive substrate, and a second plurality oftraces, at least one trace of said second plurality of traces of saidsecond stacked nonconductive substrate connected to another bond pad ofsaid plurality of bond pads on said first surface of said second stackednonconductive substrate; a second semiconductor die disposed on saidfirst surface of said second stacked nonconductive substrate, saidsecond semiconductor die connected to said at least one trace of saidsecond plurality of traces of said second stacked nonconductivesubstrate connected to said another bond pad of said plurality of bondpads on said first surface of said second stacked nonconductivesubstrate; a third semiconductor die disposed on said second surface ofsaid second stacked nonconductive substrate; a first plurality ofconnections connecting said base substrate and said first stackednonconductive substrate, at least one connection of said first pluralityof connections connecting said at least one bond pad of said pluralityof bond pads on said first surface of said base substrate to said atleast one bond pad of said plurality of bond pads on said first surfaceof said first stacked nonconductive substrate, said first plurality ofconnections connecting said base substrate and said first stackednonconductive substrate supporting said first stacked nonconductivesubstrate; a second plurality of connections connecting said secondstacked nonconductive substrate and said first stacked nonconductivesubstrate, at least one connection of said second plurality ofconnections connecting said at least one bond pad of said plurality ofbond pads on said first surface of said second stacked nonconductivesubstrate to said at least one bond pad of said plurality of bond padson said second surface of said first stacked nonconductive substrate,said second plurality of connections connecting said first stackednonconductive substrate and said second stacked nonconductive substratesupporting said second stacked nonconductive substrate; a third stackednonconductive substrate having a first surface including a plurality ofbond pads thereon, a second surface including a plurality of bond padsthereon, a first plurality of traces, at least one trace of said firstplurality of traces of said third stacked nonconductive substrateconnecting at least one bond pad of said plurality of bond pads on saidfirst surface of said third stacked nonconductive substrate to at leastone bond pad of said plurality of bond pads on said second surface ofsaid third stacked nonconductive substrate, and a second plurality oftraces, at least one trace of said second plurality of traces of saidthird stacked nonconductive substrate connected to another bond pad ofsaid plurality of bond pads on said first surface of said third stackednonconductive substrate; a fourth semiconductor die disposed on saidsecond surface of said third stacked nonconductive substrate; a fifthsemiconductor die disposed on said first surface of said third stackednonconductive substrate, said fifth semiconductor die connected to saidat least one trace of said second plurality of traces of said thirdstacked nonconductive substrate connected to said another bond pad ofsaid plurality of bond pads on said first surface of said third stackednonconductive substrate; and a third plurality of connections connectingsaid third stacked nonconductive substrate and said second stackednonconductive substrate, at least one connection of said third pluralityof connections connecting said at least one bond pad of said pluralityof bond pads on said first surface of said third stacked nonconductivesubstrate to said at least one bond pad of said plurality of bond padson said second surface of said second stacked nonconductive substrate.10. The assembly of claim 9, wherein said first plurality of connectionsincludes solder, conductive adhesives, Z-axis conductive material,flex-contacts, spring contacts, wire bonds, and TAB tape.
 11. Theassembly of claim 9, wherein said second plurality of connectionsincludes solder, conductive adhesives, Z-axis conductive material,flex-contacts, spring contacts, wire bonds, and TAB tape.
 12. Theassembly of claim 9, further comprising: a fourth plurality ofconnections, at least one connection of said fourth plurality ofconnections connecting said at least one bond pad of said plurality ofbond pads on said second surface of said base substrate to externalelectrical circuitry.
 13. The assembly of claim 9, wherein said firstsemiconductor die disposed on said first surface of said first stackednonconductive substrate is connected to said at least one trace of saidsecond plurality of traces connected to said another bond pad of saidplurality of bond pads on said first surface of said first stackednonconductive substrate through one of flip chip attachment,wirebonding, TAB tape, and a combination thereof.
 14. The assembly ofclaim 9, wherein said second semiconductor die disposed on said firstsurface of said second stacked nonconductive substrate is connected tosaid at least one trace of said second plurality of traces of saidsecond stacked nonconductive substrate connected to said another bondpad of said plurality of bond pads on said first surface of said secondstacked nonconductive substrate through one of flip chip attachment,wirebonding, TAB tape, and a combination thereof.
 15. The assembly ofclaim 9, wherein said third semiconductor die disposed on said secondsurface of said second stacked nonconductive substrate is connected tosaid at least one bond pad of said plurality of bond pads on said secondsurface of said second stacked nonconductive substrate.
 16. The assemblyof claim 9, wherein said third semiconductor die disposed on said secondsurface of said second stacked nonconductive substrate is connected tosaid at least one bond pad of said plurality of bond pads on said firstsurface of said second stacked nonconductive substrate.
 17. The assemblyof claim 9, wherein said second semiconductor die disposed on said firstsurface of said second stacked nonconductive substrate is connected tosaid at least one bond pad of said plurality of bond pads on said secondsurface of said second stacked nonconductive substrate and wherein saidthird semiconductor die disposed on said second surface of said secondstacked nonconductive substrate is connected to said at least one bondpad of said plurality of bond pads on said second surface of said secondstacked nonconductive substrate.
 18. The assembly of claim 9, furthercomprising: a fourth stacked nonconductive substrate having a firstsurface including a plurality of bond pads thereon, a second surfaceincluding a plurality of bond pads thereon, a first plurality of traces,at least one trace of said first plurality of traces of said fourthstacked nonconductive substrate connecting at least one bond pad of saidplurality of bond pads on said first surface of said fourth stackednonconductive substrate to at least one bond pad of said plurality ofbond pads on said second surface of said fourth stacked nonconductivesubstrate, and a second plurality of traces, at least one trace of saidsecond plurality of traces of said fourth stacked nonconductivesubstrate connected to another bond pad of said plurality of bond padson said first surface of said fourth stacked nonconductive substrate,said fourth stacked nonconductive substrate located above said secondstacked nonconductive substrate, said fourth stacked nonconductivesubstrate having a size less than sizes of said base substrate, saidfirst stacked nonconductive substrate, said second stacked nonconductivesubstrate, and said third stacked nonconductive substrate; a sixthsemiconductor die disposed on said first surface of said fourth stackednonconductive substrate, said sixth semiconductor die connected to saidat least one trace of said second plurality of traces of said fourthstacked nonconductive substrate connected to said another bond pad ofsaid plurality of bond pads on said first surface of said fourth stackednonconductive substrate; and a fourth plurality of connectionsconnecting said fourth stacked nonconductive substrate and said secondstacked nonconductive substrate, at least one connection of said fourthplurality of connections connecting said at least one bond pad of saidplurality of bond pads on said first surface of said fourth stackednonconductive substrate to said at least one bond pad of said pluralityof bond pads on said second surface of said second stacked nonconductivesubstrate.
 19. An assembly comprising: a base substrate having a firstsurface including a plurality of bond pads thereon, a second surfaceincluding a plurality of bond pads thereon, and a plurality of traces,at least one trace of said plurality of traces connecting at least onebond pad of said plurality of bond pads on said first surface of saidbase substrate to at least one bond pad of said plurality of bond padson said second surface of said base substrate; a first stackednonconductive substrate having a first surface including a plurality ofbond pads thereon, a second surface including a plurality of bond padsthereon, a first plurality of traces, at least one trace of said firstplurality of traces connecting at least one bond pad of said pluralityof bond pads on said first surface of said first stacked nonconductivesubstrate to at least one bond pad of said plurality of bond pads onsaid second surface of said first stacked nonconductive substrate, and asecond plurality of traces, at least one trace of said second pluralityof traces connected to another bond pad of said plurality of bond padson said first surface of said first stacked nonconductive substrate; aplurality of first semiconductor dice disposed on said first surface ofsaid first stacked nonconductive substrate, each die of said pluralityof first semiconductor dice connected to said at least one trace of saidsecond plurality of traces connected to said another bond pad of saidplurality of bond pads on said first surface of said first stackednonconductive substrate; a second stacked nonconductive substrate havinga first surface including a plurality of bond pads thereon, a secondsurface including a plurality of bond pads thereon, a first plurality oftraces, at least one trace of said first plurality of traces of saidsecond stacked nonconductive substrate connecting at least one bond padof said plurality of bond pads on said first surface of said secondstacked nonconductive substrate to at least one bond pad of saidplurality of bond pads on said second surface of said second stackednonconductive substrate, and a second plurality of traces, at least onetrace of said second plurality of traces of said second stackednonconductive substrate connected to another bond pad of said pluralityof bond pads on said first surface of said second stacked nonconductivesubstrate; a plurality of second semiconductor dice disposed on saidfirst surface of said second stacked nonconductive substrate, each dieof said plurality of second semiconductor dice connected to said atleast one trace of said second plurality of traces of said secondstacked nonconductive substrate connected to said another bond pad ofsaid plurality of bond pads on said first surface of said second stackednonconductive substrate; a plurality of third semiconductor dicedisposed on said second surface of said second stacked nonconductivesubstrate; a first plurality of connections connecting said basesubstrate and said first stacked nonconductive substrate, at least oneconnection of said first plurality of connections connecting said atleast one bond pad of said plurality of bond pads on said first surfaceof said base substrate to said at least one bond pad of said pluralityof bond pads on said first surface of said first stacked nonconductivesubstrate, said first plurality of connections connecting said basesubstrate and said first stacked nonconductive substrate supporting saidfirst stacked nonconductive substrate; a second plurality of connectionsconnecting said second stacked nonconductive substrate and said firststacked nonconductive substrate, at least one connection of said secondplurality of connections connecting said at least one bond pad of saidplurality of bond pads on said first surface of said second stackednonconductive substrate to said at least one bond pad of said pluralityof bond pads on said second surface of said first stacked nonconductivesubstrate; a third stacked nonconductive substrate having a firstsurface including a plurality of bond pads thereon, a second surfaceincluding a plurality of bond pads thereon, a first plurality of traces,at least one trace of said first plurality of traces of said thirdstacked nonconductive substrate connecting at least one bond pad of saidplurality of bond pads on said first surface of said third stackednonconductive substrate to at least one bond pad of said plurality ofbond pads on said second surface of said third stacked nonconductivesubstrate, and a second plurality of traces, at least one trace of saidsecond plurality of traces of said third stacked nonconductive substrateconnected to another bond pad of said plurality of bond pads on saidfirst surface of said third stacked nonconductive substrate; a pluralityof fourth semiconductor dice disposed on said first surface of saidthird stacked nonconductive substrate, each die of said plurality offourth semiconductor dice connected to said at least one trace of saidsecond plurality of traces of said third stacked nonconductive substrateconnected to said another bond pad of said plurality of bond pads onsaid first surface of said third stacked nonconductive substrate; aplurality of fifth semiconductor dice disposed on said second surface ofsaid third stacked nonconductive substrate; and a third plurality ofconnections connecting said third stacked nonconductive substrate andsaid second stacked nonconductive substrate, at least one connection ofsaid third plurality of connections connecting said at least one bondpad of said plurality of bond pads on said first surface of said thirdstacked nonconductive substrate to said at least one bond pad of saidplurality of bond pads on said second surface of said second stackednonconductive substrate.
 20. The assembly of claim 19 wherein saidsecond plurality of connections connecting said first stackednonconductive substrate and said second stacked nonconductive substratesupports said second stacked nonconductive substrate.
 21. The assemblyof claim 19, wherein said first plurality of connections includessolder, conductive adhesives, Z-axis conductive material, flex-contacts,spring contacts, wire bonds, and TAB tape.
 22. The assembly of claim 19,wherein said second plurality of connections includes solder, conductiveadhesives, Z-axis conductive material, flex-contacts, spring contacts,wire bonds, and TAB tape.
 23. The assembly of claim 19, furthercomprising: a fourth plurality of connections, at least one connectionof said fourth plurality of connections connecting said at least onebond pad of said plurality of bond pads on said second surface of saidbase substrate to external electrical circuitry.
 24. The assembly ofclaim 19, wherein each die of said plurality of first semiconductor dicedisposed on said first surface of said first stacked nonconductivesubstrate is connected to said at least one trace of said secondplurality of traces connected to said another bond pad of said pluralityof bond pads on said first surface of said first stacked nonconductivesubstrate through one of flip chip attachment, wirebonding, TAB tape, ora combination thereof.
 25. The assembly of claim 19, wherein each die ofsaid plurality of second semiconductor dice disposed on said firstsurface of said second stacked nonconductive substrate is connected tosaid at least one trace of said second plurality of traces of saidsecond stacked nonconductive substrate connected to said another bondpad of said plurality of bond pads on said first surface of said secondstacked nonconductive substrate through one of flip chip attachment,wirebonding, TAB tape, and a combination thereof.
 26. The assembly ofclaim 20, further comprising: a second semiconductor die disposed onsaid second surface of said first stacked nonconductive substrate, saidsecond semiconductor die connected to said at least one bond pad of saidplurality of bond pads on said second surface of said first stackednonconductive substrate.
 27. The assembly of claim 19, furthercomprising: a second semiconductor die disposed on said second surfaceof said first stacked nonconductive substrate, said second semiconductordie connected to said at least one bond pad of said plurality of bondpads on said second surface of said first stacked nonconductivesubstrate; and a third semiconductor die disposed on said second surfaceof said second stacked nonconductive substrate, said third semiconductordie connected to said at least one bond pad of said plurality of bondpads on said second surface of said second stacked nonconductivesubstrate.